日期：	2020年9月18日
时间：	8:40-17:40
地点：	广州汇华希尔顿逸林酒店

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8:40- 9:20

开幕式及致辞

Opening Remarks

周子学 中国半导体行业协会理事长

Zixue ZHOU, President of China Semiconductor Industry Association

张硕辅 广州市委书记

Shuofu Zhang, Party Secretary of Guangzhou

王曦广东省副省长

Xi WANG, Vice Governor of Guangdong Province

邱钢科技部重大专项司副司长

Gang QIU, Deputy Director General of National Science and Technology Major Project Department, Ministry of Science and Technology of the People's Republic of China
王志军 工业和信息化部副部长

Zhijun WANG, Vice Minister of the Ministry of Industry and Information Technology

9:20 –9:40

我国集成电路运行质量不断提高，高端芯片占比不断提升
The Operation Quality of Integrated Circuits in China has been Improved, and the Proportion of

于燮康 中国半导体行业协会集成电路分会执行副理事长兼秘书长
Xiekang YU, Executive Vice-president & Secretary-General of China Semiconductor Industry
Association, IC Branch

9:40-10:00

以产品为中心促设计制造联动

Product oriented chip design and manufacturing mutual action

魏少军 中国半导体行业协会副理事长、清华大学教授、核高基国家科技重大专项技术总师
Shaojun WEI, Vice President of CSIA, Professor of Tsinghua University, Chief Technology Officer of National Science and Technology Major Projects (01) Special

10:00-10:10

广州市黄埔区、广州开发区推介
Introduction of Guangzhou Development District

陈勇广州市黄埔区区长、广州开发区管委会常务副主任
Yong CHEN, Head of Guangzhou Development District

10:10-10:20

茶歇展览展示交流

10:20-10:40

专注大生产技术，为客户创造价值
Creating Values through Innovations in IC Manufacturing Technologies

赵海军 中芯国际联合首席执行官
Haijun ZHAO, Co-Chief Executive Officer of SMIC

10:40-11:00

自主创新的思考和实践
Innovative R&D - Practice and Reflection

杨士宁 长江存储科技有限责任公司首席执行官
Simon YANG, CEO of Yangtze Memory Technologies Co., Ltd. (YMTC)

11:00-11:20

我国集成电路产业发展面临的新机遇与新挑战
The opportunities and challenges for the development of Chinese integrated circuit industry

吴汉明 中国工程院院士、浙江大学微纳电子学院院长
Hanming WU, Academician of Chinese Academy of Engineering, Dean of the School of Micro-nano Electronics, Zhejiang University

11:00-11:20

双核引擎绿色智造赢芯未来
To Lead Chip Future with Dual-Core Engine and Green, Intelligent Manufacturing

周卫平 上海华虹宏力半导体制造有限公司执行副总裁
Weiping ZHOU, Executive Vice President of Shanghai Huahong Grace Semiconductor Manufacturing Corporation

11:20-11:40

卓“粤”创芯，集“制”未来

陈卫广州市半导体协会会长、广州粤芯半导体技术有限公司总裁及首席执行官
Tony CHEN, Chairman of Guangzhou Semiconductor Industry Association, President & CEO of
CanSemi Technology Inc.

12:00-13:30

自助午餐 Buffet Lunch

13:30-13:40

主题致辞广东省工业和信息化厅领导

Keynote Address, Leader from Department of Industry and Information Technology of Guangdong Province

13:40-14:00

半导体设备产业的战略重要性及发展策略

Strategic Importance and Development Strategy of Semiconductor Equipment Industry

尹志尧 博士中微半导体设备(上海)股份有限公司董事长兼首席执行官

Gerald YIN, Ph.D, Chairman and CEO of Advanced Micro-Fabrication Equipment Inc. China (AMEC)

14:00-14:20

新形势下中国集成电路产业发展的思路
China Integrated Circuit Industry Development Concept in the New Situation

顾文军 芯谋研究首席分析师

Vincent GU, Chief Analyst of ICWISE

14:20-14:40

刘伟平

北京华大九天软件有限公司董事长

14:40-15:00

国微 EDA 之路 The EDA roadmap of SMIT

帅红宇 国微集团（深圳）有限公司副董事长兼总裁

Hongyu SHUAI, Vice Chairman and President of SMIT Group Limited

15:00-15:20

芯片技术在电力工控领域的探索与应用

The Exploration and Application of Chip Technology in the Electric Power Industrial Control Field

李鹏南方电网数字电网研究院有限公司董事、总经理、党委副书记

Peng LI, Managing Director, Deputy Secretary of the CPC DGRI Committee of Digital Grid Research
Institute, China Southern Power Grid. (DGRI)

15:20-15:30

茶歇展览展示交流

15:30-15:50

智能汽车芯片发展趋势展望及思考

张进广汽研究院首席技术总监

Jin ZHANG, Chief Tec智能汽车芯片发展趋势展望及思考

Technical Director of Guangzhou Automobile Research Institute

15:50-16:10

阿斯麦公司的技术发展思路和产品路线图

Technology and Product Development Roadmap of ASML

Bo SHEN, Vice President、Country Manager – China of ASML

沈波 ASML全球副总裁、中国区总裁

16:10-16:30

风物长宜放眼量，半导体行业发展趋势及方向

Semiconductor Industry‐Trend and Direction

陈捷东电电子（上海）有限公司总裁兼首席运营官

Jay CHEN, President & COO of Tokyo Electron (Shanghai) Limite

16:30-16:50

资本市场助力国产大硅片发展

Silicon Wafer Businesses under Chinese Stock Market

李炜博士上海硅产业集团股份有限公司执行副总裁、上海新昇及新傲科技董事长

Wei LI, EVP of National Silicon Industry Group, Chairman of Zing Semiconductor Corporation & SIMGUI Technology

16:50-17:10

智能物联网时代的芯片设计IC Design in the Era of AIoT

胡胜发 博士安凯（广州）微电子技术有限公司董事长兼总裁
Shengfa HU, Chairman and CEO of Anyka

17:10-17:50

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