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2018 Semiconductor Conferences
页面更新时间:2018-05-02 11:08

      

1、2018 China Semiconductor Packaging &Test Seminar (CSPT 2018)
2、IC Industry Development Seminar China 2018, the 20th China IC Manufacturing Annual Conference (CICD 2018)
3、The 19th International Conference on Electronic Packaging Technology ( ICEPT 2018)
4、China Semiconductor Equipment Annual Conference(CSEC 2018)

 
 


2018 China Semiconductor Packaging &Test Seminar (CSPT 2018)

CSPT is the biggest professional seminar across the whole industry of semiconductor packaging & testing in China. It has been held successfully for 15 times in several cities.

Time: November 19-21st    Location: China·Hefei
Sponsor: China Semiconductor Industry Association
Organizer: Packaging Society, China Semiconductor Industry Association
                TongFu Microelectronics Co., Ltd
Scale:1000 Participants    
Format:Summit Forum + Topic Sessions+ Exhibition

Summit Forum

  • Leaders Speeches: Policy Interpretation by Relevant Leaders and Industry Experts
  •  Experts Speeches: Prospects and Development Trends of Packaging & Testing Industry at Home and Broad
  • Enterprise Reports: Designing, Manufacturing, Packaging & Testing, Equipment and Material Technology

Topic Forum

  •  Designing and Packaging &Testing
  •  Packaging Equipment and Material
  •  Corporate Finance and Mergers

 
Report Issuing of China Semiconductor Packaging Industry

1)   China Annual Report of IC Packaging Industry in 2017
2)   China Annual Discrete Devices Packaging &Testing in 2017
3)   China Annual LED Packaging &Testing Industry in 2017
4)   China Annual Metals and Ceramics Packaging Industry in 2017
5)   China Annual Packaging Critical Materials Industry in 2017
6)   China Annual Packaging Critical Materials Industry in 2017
7)   China Annual Semi-conductive Lead Frame. Industry in 2017
8)   China Annual Organic Packaging Substrate Industry in 2017
9)   China Annual Electronics Packaging Scientific Research  Development and Talents Training Organization in 2017

 


IC Industry Development Seminar China 2018, the 20th China IC Manufacturing Annual Conference (CICD 2018)


CICD is the annual meeting on Chinese IC manufacturing industry chain, which is focused on the turning point, the opportunities and challenges of the IC industry development in China, an in-depth discussion and communication will be developed. there have more than 800 delegates from all over the world take part in this meeting every year.

Time: September 12-14th, 2018  Location:Wuxi, China
Sponsor: China Semiconductor Industry Association  
Organizers: China Semiconductor Industry Association IC Branch
Scale:1000 participants    
Format: Submit Forum + Technical forum + Exhibition + Leadership dialogue
Primary coverage

  • The Turning point, Opportunities and Challenges of the IC Industry Development During the 13th Five-year Plan
  • The Acceleration of Industrialization Process, the Promotion of Cooperative innovation on IC Manufacture and Its Supporting Industries
  • The Integration of Global Industry Chain, the Realization of Leaping Development
  • The Independent Construction and Reorganization under the New Situation
  • The Docking of Major Projects on Technology and IC Industry Investment Funds
  • The Current Situation and Future of IC Manufacturing Industry
  • The Industrialized Process of Advanced Packaging & Testing Technology
  • The Breakthroughs of Core Foundation Technology for 32-28 Nano Key Manufacturing Equipment
  • The Existing Problems and Countermeasures in China’s IC Equipments Manufacturing Industry

 

 
 

The 19th International Conference on Electronic Packaging Technology ( ICEPT 2018)

ICEPT is a professional technology conference on global electronic packaging technology, each session has gather large numbers of experts including Nobel Prize winner.

Time: August 8-11th, 2018  Location: Shanghai, China
Sponsor: Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics, China; IEEE Component, Packaging & Manufacturing Technology Society (IEEE-CPMT); Fudan University
Organizer: Electronic Packaging Division, Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics, China.
Meeting Scale:700 Participants   
Meeting Format: Course training + advanced technical report + Exhibition
Primary coverage

  • The advanced packaging and system integration
  • The packaging materials and process
  • The design and Simulation of the package
  • The advanced manufacturing technology and packaging equipment
  • The quality and reliability
  • The solid-state lighting encapsulation and integration
  • In the emerging field of packaging
  •  

 


Contact: Janey Shi
Tel:021-38953725-8002  60345020 
Mobile:13661508648
Email: janey.shi@cepem.com.cn, janey273610@163.com