高峰论坛

2021-10-22 作者: system
日期: 2021年11月2日
时间: 08:30-17:40
地点: 广州黄埔君澜酒店

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议程下载:

http://cepem.com.cn/files/CICD2021会议议程.pdf

 

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开幕式 Opening Ceremony

 

主持人/ Moderator

 

叶甜春 中国半导体行业协会集成电路分会理事长、国家科技重大专项02专项技术总师、中国集成电路创新联盟副理事长兼秘书长

Tianchun YE, President of Academy of Integrated circuit, Chinese Academy of Sciences; Head of Overall Panel of National Science and Technology Major Projects (02);Vice President of China Semiconductor Industry Association

 

时间/Time

内容 / Content

08:30-08:50

大会致辞 Welcome Remarks

 

中国半导体行业协会领导

Leader from China Semiconductor Industry Association

广东省领导

Leader of Guangdong Province

广州市领导

Leader from Guangzhou

国家科技部领导

Leader from the Ministry of Science and Technology of the People's Republic of China

工业和信息化部领导

Leader from the Ministry of Industry and Information Technology

国家发改委领导

Leader from the National Development and Reform Commission

 

仪式环节  Publishing & Signing & Awarding Ceremony

 

08:50-09:30

仪式环节

 

09:30-09:40

 

 

黄埔集成电路产业政策推荐

IC Industry Policy Of Huangpu District

陈勇 广州黄埔区区委书记、广州开发区管委会常务副主任

Yong CHEN, Secretary of Guangzhou Huangpu District & Executive deputy director of Guangzhou Development Zone

 

09:40-10:00

茶歇与展览交流 Networking Break

 

高峰论坛 —— 特邀专家报告

Summit Forum——Plenary Talk

 

主持人:于燮康 中国半导体行业协会集成电路分会常务副理事长

Xiekang YU, Executive Vice-president of IC Branch of China Semiconductor Industry Association

10:00-10:20

 

中国集成电路制造产业现状与展望

Current Status and Outlook of China IC Manufacturing Industry

叶甜春 中国半导体行业协会集成电路分会理事长,国家科技重大专项02专项技术总师,中国集成电路创新联盟副理事长兼秘书长

Tianchun YE, President of Academy of Integrated circuit, Chinese Academy of Sciences; Head of Overall Panel of National Science and Technology Major Projects (02);Vice President of China Semiconductor Industry Association

10:20-10:40

 

第三代半导体创新与发展

Innovation And Development Of The Third Generation Semiconductor

郝跃 中国科学院院士

Yue HAO, Academician of CAS

10:40-11:00

 

三维集成技术释放芯动能——思考与实践

3D Integration Architectures To Unleash The Core Energy Of IC Industry——Thinking And Practicing 

杨士宁 博士 长江存储科技有限责任公司首席执行官

Simon Yang, PhD, CEO of Yangtze Memory Technologies Co., Ltd

11:00-11:20

 

技术演进+应用驱动 功率领跑千亿赛道

Power Semiconductor Leads Industry Track By Technology Evolution And Application Driving

李虹  博士 华润微电子有限公司首席运营官

Dr. Hong Li, Executive Director and COO of China Resources Microelectronics Limited Company

 

11:20-11:40

 

粤港澳大湾区集成电路产业链协同发展的探索与实践

Exploration And Practice Of Synergistic Development Of Integrated Circuit Industry In The Greater Bay Area

陈卫  广州粤芯半导体技术有限公司总裁及首席执行官

TONY CHEN, CEO & President of CanSemi Technology Inc.

 

11:40-12:00

以产融结合的综合服务 助力我国集成电路产业跨越发展

Comprehensive Services Based On The Combination Of Industry And Finance, Boost The Leapfrog Development Of Chinese IC Industry

杜洋 芯鑫融资租赁有限责任公司董事长兼总裁

Yang DU, Chairman and President of SINO IC LEASING Co., Ltd.

 

12:00-13:20

自助午餐 Buffet Lunch

 

高峰论坛 —产业报告

Summit Forum ---Keynote Speech

 

主持人:秦舒 中国半导体行业协会集成电路分会秘书长

Moderator: Shu QIN, Secretary of IC Branch of China Semiconductor Industry Association

13:20-13:40

 

 

国产大硅片崛起的机遇与挑战

The Opportunity and Challenge of Domestic 300mm Si Wafer Supply

 

邱慈云  博士 上海硅产业集团股份有限公司总裁/上海新昇半导体科技有限公司 CEO

Dr. TZU-YIN CHIU, National Silicon Industry Group  President / Zing Semiconductor Corporation  CEO

13:40-14:00

 

碳中和背景下的半导体产业机遇

Semiconductor Development Opp. in the Context of Carbon Neutralization

曹志平 意法半导体副总裁、中国区总经理

Henry Cao, Vice President of STMicroelectronics, Managing Director China

14:00-14:20

 

国产显示价值链赛道规模初具,只待显示驱动芯片产能释放补短板

The Scale Of Domestic Display Value Chain Track Is Beginning To Take Shape, And Only The Capacity Of Display Driver Chip Is Released To Make Up For Shortcomings

张晋芳 北京集创北方科技股份有限公司创始人兼首席执行官(CEO)

Frank ZHANG, founder and CEO of Chipone Technology (Beijing) Co., Ltd

14:20-14:40

 

晶圆厂MES发展历程和实践感悟

MES History of Fab & Practice Summary

吕凌志 博士 上扬软件(上海)有限公司 董事长兼CEO

Dr. Lu Lingzhi, FA Software (Shanghai) Co., Ltd,  Managing Director & CEO

 

14:40-15:00

面向集成电路产业链的质量保障技术

The Quality Assurance Technology for Integrated Circuit Industry Chain

恩云飞  工业和信息化部电子第五研究所总工程师

Yunfei EN, The Chief Engineer of China Electronic Product Reliability and Environmental Testing Research Institute

15:00-15:15

茶歇与展览交流 Networking Break

 

主持人:王国平  中国半导体行业协会集成电路分会特聘顾问

Moderator: Guoping WANG, Distinguished Consultant of IC Branch of China Semiconductor Industry Association

 

15:15-15:35

 

移动操作机器人如何助力半导体晶圆厂实现智能化升级

How to realize Intelligent Manufacturing in SEMI FAB by using AGV、AMR

黄建龙 深圳优艾智合机器人有限公司 半导体自动化事业部总经理

Kent Huang, Semiconductor AMHS BU General Manager of Shenzhen Youibot Robotics Co.,Ltd.

 

15:35-15:55

 

电子生态系统的下一波演进: 挑战和未来

Continuing Evolution of the Electronics Ecosystem: Challenges & Future

凌 琳 西门子EDA全球副总裁,中国区总经理

Pete Ling, Vice President of China Country Manager, Siemens EDA

 

15:55-16:15

 

独立第三方芯片测试产业崛起之路 

The rise of independent third-party IC testing industry

张亦锋 广东利扬芯片测试股份有限公司董事总经理

Yifeng  Zhang, CEO of Guangdong Leadyo IC Testing Co.,Ltd.

 

16:15-16:35

 

加快安全智能边缘计算的发展

Accelerating the Secure Intelligent Edge

钱志军 恩智浦半导体大中华区副总裁

Jason Qian,VP,Global Sales & Marketing, Greater China, NXP Semiconductors

 

圆桌对话——新开局、新挑战、芯生机、芯活力

Round table dialogue --- New Opening, New Challenge, IC Opportunities, Chip Energy

主持人:陈南翔 中国半导体协会集成电路分会常务副理事长/长江存储执行董事长

Moderator: Nanxiang CHEN, Vice President of IC Branch of China Semiconductor Industry Association, Executive Chairman of Yangtze Memory Technologies Co., Ltd

16:35-17:25

嘉宾(排名不分先后)Guests(in no particular order)

 

陈卫  广州粤芯半导体技术有限公司总裁兼CEO

TONY CHEN, CEO & President of CanSemi Technology Inc.

赵晋荣  北方华创科技集团股份有限公司董事长

Jinrong ZHAO, Chairman of NAURA Technology Group Co., Ltd.

陈伟  矽力杰半导体技术有限公司总裁以及首席执行官

Wei CHEN, Chairman of Silergy Corp.

陈刚  比亚迪半导体股份有限公司总经理

Gang CHEN, General Manager of BYD Micro.

王淑敏  安集微电子科技(上海)股份有限公司董事长兼CEO

Shumin WANG, Chairman & CEO of Anjimirco Shanghai Co.,Ltd

郑 力 江苏长电科技股份有限公司董事、首席执行官

Li ZHEGN, Director of Board,CEO of JCET Group Co., Ltd.

18:20-21:00

欢迎晚宴 Welcome Banquet

演出+抽奖 Dinner Show + Lucky Draw

 

特别鸣谢:中国电子系统工程第二建设有限公司、北方华创科技集团股份有限公司、安集微电子科技(上海)股份有限公司、深圳中科飞测科技股份有限公司、通富微电子股份有限公司、赛默飞世尔电子技术研发(上海)有限公司

NAURA Technology Group Co., Ltd., Anjimirco Shanghai Co.,Ltd., China Electronics System Engineering No.2 Construction Co., Ltd., Tongfu Microelectronics Co., Ltd.,

 

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