主持人：阮舒拉

Moderator：Shula Ruan

中国半导体行业协会集成电路分会副秘书长

Deputy Secretary General of the Integrated Circuit Branch of the China Semiconductor Industry Association

李海明 重庆芯联微电子有限公司副总裁

Herman Lee, Senior Vice President, Chongqing Xinlian Microelectronics Co., Ltd.

新质协同，创新同行

Synergizing new qualities, succeeding with innovations

吴关平 无锡邑文微电子科技股份有限公司刻蚀事业部副总经理

Chuck Wu, VP, Advanced Materials Technology& Engineering Co., Ltd.

在新的形势下中小型半导体装备公司的突破之路

The Breakthrough Path for Small and Medium-sized Semiconductor Equipment Companies in the diversified and competitive Situation

何建锡 江苏元夫半导体科技有限公司副总经理

Desmond Hor, General manager, Jiangsu Leadlap Semiconductor Technology Co., Ltd.

先进封装基石：隐切+研磨抛光&贴膜撕膜+扩片的的协同创新

The cornerstone of advanced packaging: the collaborative innovation of SDBG process solution

徐景瑞  中导光电设备股份有限公司高级副总裁

Knight Xu, Senior Vice President, Zhongdao Optoelectronic Equipment Co.,Ltd.

半导体芯片制造缺陷检测技术及设备

Defect inspection technology and equipments in Semiconductor chip manufacturing

刘申  广东阿达半导体设备股份有限公司销售总监

Johnson，Sales Director, Guangdong ADA Semiconductor Equipment Ltd.

阿达半导体推动焊线机与先进封装装备国产化发展

ADA SEMI promotes the localization of wire bonder and advanced packaging equipment

贾照伟 盛美半导体设备（上海）股份有限公司工艺部副总裁

Zhaowei Jia,  Vice President, ACM Research (Shanghai), Inc.

三维芯片集成领域电镀技术的挑战和机遇

Challenges and Opportunities of Electroplating Technology in the Field of 3D Chip Integration

孙斌 武汉华康世纪医疗股份有限公司销售经理

SUN BIN, Sales Manager, Wuhan Huakang Century Clean Technology Co., Ltd

12”半导体工厂洁净室系统介绍

Introduction to 12-Inch Semiconductor Fabrication Plant Cleanroom Systems

王天也 凌云光技术股份有限公司解决方案总监

Tianye Wang, Solution Director,LUSTER LightTech Co., Ltd.

凌云光器件：半导体高精度缺陷检测的智能引擎

LSUTER Device: Advanced Driver for High-Precision Semiconductor Defect Detection

9月5日会议议程

张汀 上海积塔半导体有限公司总监

Zhang Ting, Director,GTA semiconductor company

碳化硅制造产业供应链国产化新进展

New Progress in the Localization of the Supply Chain for the Silicon Carbide Manufacturing Industry

华金东 中国电子系统工程第二建设有限公司华东大区副总工程师

Hua Jindong, Deputy Chief Engineer of East China Region,China Electronics System Engineering No.2 Construction Co., Ltd.

保驾护航：半导体工厂建设的顶层规划

Guiding the Way: Top-level Planning for Semiconductor Factory Construction

蔡汉平 浙江厚积科技有限公司设备制造事业部总经理

Kevin Tsai, GM of the Equipment Manufacturing Division, Zhejiang Houji Technology Co. Ltd

先进封装及TGV关键技术的发展历程

The Development History of Advanced Packaging and TGV Critical Technologies

蔡霆 华海清科股份有限公司技术总监

Tick Cai，Technical director，Hwatsing Technology Co.,Ltd.

国产离子注入装备的挑战和未来

Challenges and Future of Domestic Ion Implantation Equipment

朱列平 博士 蓝星东丽膜科技（北京）有限公司技术总监

Dr.ZHU LIEPING, CTO, Toray Bluestar Membrane Co.,Ltd

东丽膜技术助力实现工业纯水节能生产与废水高值化回用

Toray membrane technology helps achieve energy-efficient production of industrial pure water and high-value reuse of wastewater

陈飞彪 矽赫微科技（上海）有限公司产品总监

Chen Feibiao, Product Director, SHW Technologies (Shanghai) Co., Ltd.

高效无损的超高真空直接键合技术

Efficient and non-destructive ultra-high vacuum direct bonding technology

郑军 聚时科技（上海）有限公司首席执行官

Jun Zheng, CEO, Matrixtime Robotics Co.,Ltd.

精密视觉与深度学习助力晶圆缺陷检测

Precision Vision and Deep Learning for Wafer Defect Inspection

刘斌 博士 埃克斯控股（北京）有限公司首席技术官

Dr. Liu Bin, CTO，IKAS Holdings (Beijing) Co., Ltd.

题目待定